Ultra-Precise Picosecond China Laser Cutting Machine for for Semiconductor 3c Glass

Customization: Available
After-sales Service: Remote Technical Support
Warranty: 12 Months

Product Description

Overview
Basic Info.
Model NO. CW-6050FZ/PZ/Z Application Aerospace Industry, Automotive Industry, Semiconductors/3c/Glass/Biomedical
Cooling System Water Cooling Technical Class Pulse Laser
Applicable Material Nonmetal Structure Type Gantry Type
Laser Classification Solid Laser Laser Technology Laser Flame Cutting
Laser Type Ultrafast Laser Laser Power 10W/30W/35W
Working Area 500*610mm Positioning Accuracy ±1um
Processing Speed ≤3000mm/S Processing Accuracy ≤30um
Focus Spot ≤20um Scan Range of Galavanometer 50*50um
Machinery Test Report Provided Video Outgoing-Inspection Provided
Certification CE Processing Thickness 3mm
Processing Material Pi Film, Cover Film, FPC, PCB, etc. Power Supply Three-Phase 380V AC, 50Hz, 60Hz 20A
Transport Package Wooden Case Specification 2200*1500*1750mm
Production Capacity 100sets/Month
Product Description
Picosecond Laser Cutting Machine (UV/IR/Green Light)

Comprehensive laser solutions are designed for precision processing in the glass industry. Core features include cold processing, high precision, low edge breakage, stress-free operation, high efficiency, and environmental friendliness. It is particularly suitable for processing ultra-thin, irregular, and high-demand glass.

Equipment Advantages
  • Ultra-short pulse cold processing: Pulse width < 10ps, with energy injected instantaneously to directly vaporize materials. Heat diffusion is minimized, resulting in an extremely small heat-affected zone (HAZ) near zero, avoiding thermal cracking, melting, and discoloration of glass.
  • Infrared wavelength compatibility: 1064nm infrared light has good transmittance to glass and can focus on internal modification, suitable for transparent/translucent hard and brittle glass (ordinary glass, high borosilicate glass, quartz glass, sapphire, etc.).
  • Non-contact processing: No cutter wheels, no mechanical stress, no chipping, no delamination, no surface scratches, and high retention of glass strength.
Application Fields

Widely used in the production of automotive glass (windshield/rear view mirror glass), automotive display covers, optical glass, security glass, home appliance glass panels, lighting glass, and medical glass. Features green processing with no dust, no wastewater, no cutting fluid, and no chemical pollution, in compliance with RoHS standards. Direct assembly after cutting eliminates multiple post-processing steps, improving yield and reducing overall costs.

Ultra-Precise Picosecond Laser Cutting Machine for Semiconductor 3c Glass
Key Configurations
  • Ultra-low chipping: Chipping ≤ 5μm (industry-leading), far better than mechanical cutting (>50μm), with smooth cross-sections, no burrs, and no tapering.
  • High precision: Positioning accuracy ±3μm, stable repeat positioning, narrow kerf, and clear contours, supporting micron-level special-shaped cutting (round holes, rounded corners, complex curves).
  • No internal stress / micro-cracks: Edge strength is about 2.5 times that of traditional cutting. Secondary grinding, polishing, and strengthening are not required; finished products are obtained directly after cutting.
Laser Cutting Machine detail 1 Laser Cutting Machine detail 2 Laser Cutting Machine detail 3
Laser Cutting Machine detail 4 Laser Cutting Machine detail 5 Laser Cutting Machine detail 6
Technical Specifications

With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the strictest tolerances of 3C electronics, semiconductor, and aerospace industries.

Parameter Value Parameter Value
Laser power 30W Dimensions 2200*1500*1750mm
Working area 500*610mm Certification CE
Positioning Accuracy ±1um Machinery Test Report Provided
Processing speed ≤3000mm/s Video outgoing-inspection Provided
Processing accuracy ≤30um Warranty of core components 12 Months
Focus Spot ≤20um Applicable Industries Solar panels
Scan range of galavanometer 50*50um Core Components Picosecond/Nanosecond/UV
Company Profile
Laser Technology Corporate Profile
1. Founded in 2012.
2. National high-tech enterprise, owning 150 national patents, and participating in the formulation of industry standards.
3. Gazelle Enterprise, Technology-based Enterprise, Innovation-Based Enterprise, and partner of Fortune Global 500 Enterprises.
4. 80,000 square meters of production factories; five major R&D, production, and sales bases.
5. Supplier of laser engraving equipment for major international sports events; Super Factory status.
6. More than 100 offices and agents domestically and abroad, including factories and service centers.
7. Products exported to more than 100 countries, providing high-quality equipment and efficient services to industrial customers worldwide.
R&D Base 1 R&D Base 2 R&D Base 3
Quality Standard Lab
Why Choose Us?

We have achieved full-process digitalization of after-sales service, providing customers with professional and efficient after-sales support via the Service Mobile intelligent management system. We are committed to the mission of ensuring every customer uses laser machines well to help them create greater benefits.

Service Team Commitment
Service Commitment

We strictly adhere to the ISO9001: 2015 international quality management system standard. With the spirit of striving for excellence, we are committed to manufacturing superior quality products for our customers. A nationwide toll-free service hotline is available for 24 hours, and a professional service team responds quickly to effectively support your needs.

Invention Patent

As a leader in the laser technology field, the enterprise has acquired 150 national patents and successfully established two independent brands. We have established a strict enterprise product quality standard system with comprehensive filing to the quality supervision department, and have deeply participated in the formulation of multiple industry standards. To strengthen R&R and service capabilities, we have built a process R&D center equipped with dozens of advanced laser processing systems, providing both comprehensive laser processing value-added services and solid hardware support for continuous innovation.

Patent Certification Document 1 Patent Certification Document 2
Laser Application Lab
Advantages of Cooperating With Us
  • Stable & High-Precision Equipment: With advanced ultraviolet, picosecond, and other laser technologies, our machines deliver high processing accuracy, stable performance, and long service life.
  • Cost-Effective & Efficient Production: Our laser equipment features low energy consumption, low maintenance costs, and high processing speeds, effectively shortening production cycles.
  • Comprehensive After-Sales Service: We offer on-site installation, commissioning, operator training, and timely technical support to minimize downtime.
  • Strong R&D & Technical Support: Backed by a professional R&D team, we continuously upgrade technology and functions to help customers stay competitive.
Manufacturing Factory Floor Overview
Trade Show booth 1 Trade Show booth 2 Trade Show booth 3
International Exhibition Exchange
Our Exhibition

We showcase cutting-edge laser equipment, such as the UV picosecond laser cutting machine, to enhance brand visibility and reputation both domestically and internationally. We target potential clients from emerging markets and expand the global customer base.

Technical Exchange Forums
Industry Communication & Technology Exchange

We engage in in-depth exchanges with peers, industry experts, and research institutions to keep abreast of the latest trends in laser processing technology, market demands, and regulatory policies.

Team Building Activity 1
Team Building & Culture

We are committed to creating a healthy, safe, and harmonious working environment for our employees, while also practicing green development and actively fulfilling social responsibilities.

Team Building Activity 2
Employee Well-Being Improvement

We optimize living conditions, steadily increase income levels, and strengthen skills training to support long-term employee career development.

Packaging & Shipping
Wooden Case Packaging preparation Secured Shipping Inside Container Transportation Loading
After Sales Service
  • We provide comprehensive technical support, including remote video guidance and professional telephone consultation, along with e-commerce value-added services, to provide our customers with a convenient experience.
  • We promise a long-term and stable supply of genuine parts and high-quality consumables to ensure that the equipment is always in optimal operating condition.
Frequently Asked Questions
What can we do for you?
We are committed to providing you with advanced equipment, technical solutions, and comprehensive service support to help you improve production efficiency, reduce costs, and optimize product quality.
Are you a trade company or manufacturer?
We are a manufacturer with independent research and development capabilities as well as comprehensive manufacturing capabilities.
What is your typical delivery date?
Typically about 35 days after receipt of payment.
Can we become your agent?
We warmly welcome global agents to cooperate with us. We will provide full support for agents to expand the market, including professional solutions for technical issues and comprehensive after-sales service. In addition, our agents enjoy favorable discount policies and commission returns.
What does your after-sales service and warranty cover?
We offer a one-year warranty and lifetime service for the products. During the warranty period, if the equipment malfunctions or components are damaged (excluding human factors and force majeure), the supplier will be responsible for free repair. Required replacement parts will be provided free of charge (excluding consumables). After the warranty period, we provide multiple support methods to ensure regular system operation.
What materials can this picosecond laser machine process?
This system is highly optimized for nonmetal materials including Pi Film, Cover Film, FPC, PCB, and various types of glass (ordinary glass, high borosilicate glass, quartz glass, sapphire, etc.).

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